The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Mar. 14, 2018
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Ming Yen Lee, Kaohsiung, TW;
Chia Hao Sung, Kaohsiung, TW;
Ching-Han Huang, Kaohsiung, TW;
Yu-Hsuan Tsai, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H01L 23/538 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/52 (2006.01); H01L 23/525 (2006.01); H01L 21/66 (2006.01); B81C 3/00 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/12 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0061 (2013.01); B81B 3/007 (2013.01); B81C 1/00658 (2013.01); B81C 3/001 (2013.01); H01L 22/22 (2013.01); H01L 23/12 (2013.01); H01L 23/13 (2013.01); H01L 23/28 (2013.01); H01L 23/31 (2013.01); H01L 23/3157 (2013.01); H01L 23/481 (2013.01); H01L 23/52 (2013.01); H01L 23/525 (2013.01); H01L 23/5226 (2013.01); H01L 23/5382 (2013.01); H01L 23/5386 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/07 (2013.01); B81C 2201/0156 (2013.01); B81C 2203/032 (2013.01);
Abstract
The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.