The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2020
Filed:
Jan. 30, 2018
Te Connectivity Corporation, Berwyn, PA (US);
Hailing Liu, Fremont, CA (US);
Rebecca Wan Chai, Fremont, CA (US);
Lei Wang, San Jose, CA (US);
Peter Dutton, Fremont, CA (US);
TE CONNECTIVITY CORPORATION, Berwyn, PA (US);
Abstract
System includes a first object having an energy-assisted bonding (EAB) mechanism along a surface of the first object. The EAB mechanism includes a heat-activatable adhesive layer and a carbon-filled (CF) sheet material. The CF sheet material is electrically conductive for resistive heating. A control sub-system is configured to control a coupling actuator to drive an actuator body toward the first object, wherein the actuator body and the first object engage each other. The coupling actuator is configured to apply pressure to the EAB mechanism along the surface of the first object. The control sub-system is also configured to control the power source to apply a current through the CF sheet material of the EAB mechanism to provide thermal energy through resistive heating that activates the adhesive layer along the interface.