The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Jun. 06, 2018
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Eng Huat Toh, Singapore, SG;

Shyue Seng Tan, Singapore, SG;

Danny Pak-Chum Shum, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 27/11521 (2017.01); G11C 16/10 (2006.01); G11C 16/04 (2006.01); H01L 27/11519 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11521 (2013.01); G11C 16/0441 (2013.01); G11C 16/10 (2013.01); H01L 27/11519 (2013.01);
Abstract

A method of forming a low-cost and compact hybrid SOI and bulk MTP cell and the resulting devices are provided. Embodiments include forming a bulk region in a SOI wafer; forming an NW in the bulk region and a PW in a remaining SOI region of the SOI wafer; forming first and second pairs of common FG stacks over both of the SOI and bulk regions; forming a first shared N+ RSD between each common FG stack of the first and second pairs in a top Si layer; forming a N+ RSD in the top Si layer of the SOI region on an opposite side of each common FG stack from the first shared N+ RSD; forming a second shared N+ RSD between each common FG stack in the bulk region; and forming a P+ RSD between the first and second pairs in the bulk region.


Find Patent Forward Citations

Loading…