The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Feb. 05, 2018
Applicant:

Catlam, Llc, Sunnyvale, CA (US);

Inventors:

Kenneth S. Bahl, Saratoga, CA (US);

Konstantine Karavakis, Pleasanton, CA (US);

Assignee:

CATLAM LLC, Sunnyvale, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); C23C 18/16 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); C23C 18/20 (2006.01); H05K 3/18 (2006.01); H05K 3/32 (2006.01); H05K 3/42 (2006.01); C23C 18/38 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/204 (2013.01); C23C 18/38 (2013.01); H01L 21/4846 (2013.01); H01L 21/563 (2013.01); H01L 23/145 (2013.01); H01L 23/49894 (2013.01); H01L 24/06 (2013.01); H01L 24/24 (2013.01); H01L 24/27 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H05K 3/185 (2013.01); H05K 3/32 (2013.01); H05K 3/422 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/27464 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29553 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/83639 (2013.01); H01L 2224/83644 (2013.01); H01L 2224/83647 (2013.01); H01L 2224/83655 (2013.01); H01L 2224/83657 (2013.01); H01L 2224/83678 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A catalytic laminate is formed from a resin, a fiber reinforced layer, and catalytic particles such that the catalytic particles are disposed throughout the catalytic laminate but excluded from the outer surface of the catalytic laminate. The catalytic laminate has trace channels and vias formed to make a single or multi-layer catalytic laminate printed circuit board. Apertures with locations which match the locations of integrated circuit pads are formed in the laminate PCB. The integrated circuit is bonded to the catalytic laminate PCB, and the integrated circuit and laminate are both subjected to electroless plating, thereby electrically connecting the integrated circuit to the single or multi-layer catalytic laminate PCB.


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