The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Sep. 30, 2018
System, method, and computer program product for displaying bump layout for manufacturing variations
Cadence Design Systems, Inc., San Jose, CA (US);
Jean-François Alain Lepère, Le Versoud, FR;
Arnold Ginetti, Antibes, FR;
Cadence Design Systems, Inc., San Jose, CA (US);
Abstract
The present disclosure relates to a computer-implemented method for use in design for manufacturing associated with a die or package. Embodiments may include providing, using a processor, an electronic design and displaying, at a graphical user interface, at least a portion of a layout associated with the electronic design. Embodiments may also include determining an expected thermal or centrifuge force manufacturing variation associated with the electronic design. Embodiments may further include allowing a user to insert, at the graphical user interface prior to signoff, a copper pillar bump or solder bump on at least a portion of the layout based upon, at least in part, the determined expected thermal or centrifuge force manufacturing variation. Embodiments may further include displaying the copper pillar bump or the solder bump on the layout at the graphical user interface.