The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Dec. 22, 2017
Applicant:

Koh Young Technology Inc., Seoul, KR;

Inventors:

Jeong Kyu Noh, Seoul, KR;

Jae Hwan Lee, Seoul, KR;

Duk Young Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G01R 31/28 (2006.01); G06T 7/00 (2017.01); B41F 33/00 (2006.01); B41F 15/26 (2006.01); G01N 21/88 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
G01R 31/28 (2013.01); B41F 15/26 (2013.01); B41F 33/0027 (2013.01); B41F 33/0036 (2013.01); B41F 33/0045 (2013.01); G01N 21/8806 (2013.01); G06T 7/0004 (2013.01); H05K 1/0268 (2013.01); H05K 1/0269 (2013.01); H05K 3/34 (2013.01); H05K 13/08 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30141 (2013.01); G06T 2207/30152 (2013.01); H05K 3/3484 (2013.01);
Abstract

A printed circuit board inspection apparatus obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.


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