The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Sep. 27, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventor:

Brian J. Long, Folsom, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/40 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H05K 1/111 (2013.01); H05K 1/117 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/34 (2013.01); H05K 3/368 (2013.01); H05K 3/4015 (2013.01); H01R 12/721 (2013.01); H05K 1/185 (2013.01); H05K 2201/042 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

Aspects of the disclosure are directed to an edge card that includes a printed circuit board having a top side and a bottom side. The top side of the printed circuit board can include one or more top-side circuit components, and a plurality of top-side metal contact fingers, at least some of the top-side metal contact fingers electrically connected to at least one of the one or more circuit components. The bottom side of the printed circuit board can include one or more bottom-side circuit components. The bottom side of the printed circuit board can also include a substrate interposer having a top side and a bottom side. The top side of the substrate interposer can include one or more passive circuit components at least partially embedded in the substrate interposer, and one or more solder balls arranged around the one or more passive circuit components.


Find Patent Forward Citations

Loading…