The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Feb. 13, 2019
Applicant:

Te Connectivity Corporation, Berwyn, PA (US);

Inventors:

Bruce Allen Champion, Camp Hill, PA (US);

Christopher William Blackburn, Bothell, WA (US);

Michael David Herring, Apex, NC (US);

Eric David Briant, Dillsburg, PA (US);

Assignee:

TE CONNECTIVITY CORPORATION, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/659 (2011.01); H01R 13/66 (2006.01); H01R 12/72 (2011.01); H01R 12/59 (2011.01); H01R 13/6587 (2011.01); H01R 13/6589 (2011.01); H01R 12/91 (2011.01); H01R 12/71 (2011.01); H01R 12/62 (2011.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H01R 13/659 (2013.01); H01R 12/598 (2013.01); H01R 12/62 (2013.01); H01R 12/714 (2013.01); H01R 12/724 (2013.01); H01R 12/732 (2013.01); H01R 12/91 (2013.01); H01R 13/6587 (2013.01); H01R 13/6589 (2013.01); H01R 13/6658 (2013.01);
Abstract

A communication system includes a host circuit board and an interposer assembly coupled to the host circuit board having an interposer substrate including an upper surface and a lower surface. The interposer assembly has host circuit board contacts electrically connected to contact pads of the host circuit board and cable assembly contacts coupled to a pluggable module. The pluggable module includes a mating interface along a bottom of the pluggable module facing the interposer assembly. The pluggable module includes a cable assembly having a cable at the cable end. The cable has a signal conductor and a ground conductor being electrically connected to corresponding cable assembly contacts of the interposer assembly at the upper surface of the interposer substrate.


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