The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Mar. 05, 2018
Applicant:
Win Semiconductors Corp., Tao Yuan, TW;
Inventors:
Chih-Wen Huang, Taoyuan, TW;
Jui-Chieh Chiu, Taoyuan, TW;
Assignee:
WIN Semiconductors Corp., Tao Yuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/3157 (2013.01); H01L 23/48 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A semiconductor device is disclosed. The semiconductor device includes a substrate; an active circuit portion including at least an active component and formed on a topside of the semiconductor device; and a radiating metal sheet formed on a backside of the semiconductor device. A hole is formed within the substrate and the hole penetrates through the substrate. The active circuit portion and the radiating metal sheet are coupled through the hole.