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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10679897 B1

PDFFull Text
Date of Patent:
Jun. 09, 2020

Filed:

Nov. 21, 2017

Device wafer processing method

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Koichi Shigematsu, Tokyo, JP;

Satoshi Kumazawa, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain, Ltd.

Primary Examiner:

Khaja Ahmad

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/02 (2006.01); H01L 21/3065 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/308 (2006.01); H01L 21/683 (2006.01); H01L 21/68 (2006.01); H01L 23/544 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/02076 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/3083 (2013.01); H01L 21/6836 (2013.01); H01L 22/20 (2013.01); H01L 21/30625 (2013.01); H01L 21/67069 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); H01L 21/681 (2013.01); H01L 23/544 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54453 (2013.01);
Abstract

Disclosed herein is a device wafer processing method including a protective film forming step of applying a water-soluble protective film material to the front side of a device wafer having devices separated by division lines and next exposing the division lines to form a protective film for protecting each device, an application time recording step of recording the time at which the water-soluble protective film material is applied to the device wafer, a determining step of determining whether or not a predetermined duration has elapsed from the time recorded in the application time recording step, an etching step of dry-etching the device wafer along the division lines after performing the determining step, and a protective film removing step of supplying a cleaning water to the protective film to thereby remove the protective film after performing the etching step. Only when it is determined in the determining step that the predetermined duration has not elapsed, the etching step is performed.

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