The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Oct. 21, 2016
Applicant:

Bystronic Laser Ag, Niederönz, CH;

Inventors:

Andreas Lüdi, Burgdorf, CH;

Roland Bader, Rütschelen, CH;

Assignee:

BYSTRONIC LASER AG, Niederonz, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/02 (2014.01); B23K 26/38 (2014.01); B23K 26/03 (2006.01); B23K 31/12 (2006.01); B23K 31/00 (2006.01); B23K 26/06 (2014.01);
U.S. Cl.
CPC ...
B23K 26/032 (2013.01); B23K 26/0626 (2013.01); B23K 26/38 (2013.01); B23K 31/00 (2013.01); B23K 31/125 (2013.01);
Abstract

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. The cutting process is interrupted after a first partial processing step, whereupon a partial section (K. . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted and the cutting process continued with the changed set of cutting parameters.


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