The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
May. 31, 2017
Ibiden Co., Ltd., Ogaki, JP;
Naoki Kurahashi, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and conductor layers on the first surface of the substrate, and forming a second build-up structure including interlayer insulating layers and one or more conductor layers on the second surface of the substrate. The forming of the first structure includes laminating the insulating layers and metal layers on first surface side of the substrate and forming the conductor layers from all of the metal layers on the first surface side, and the forming of the second structure includes laminating the insulating layers and metal layers on second surface side of the substrate, forming the one or more conductor layers from one or more of the metal layers on the second surface side, and entirely removing the other metal layers on the second surface side.