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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10674604 B1

PDFFull Text
Date of Patent:
Jun. 02, 2020

Filed:

Oct. 31, 2016

Printed wiring board and method for manufacturing the same

Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Teruyuki Ishihara, Ogaki, JP;

Hiroyuki Ban, Ogaki, JP;

Haiying Mei, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Ishwarbhai B Patel

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H05K 1/05 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/20 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 21/486 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H05K 1/056 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/06 (2013.01); H05K 3/4007 (2013.01); H05K 3/467 (2013.01); H05K 3/4682 (2013.01); H01L 21/6835 (2013.01); H01L 23/3121 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16225 (2013.01); H05K 3/007 (2013.01); H05K 3/205 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10954 (2013.01); H05K 2203/072 (2013.01);
Abstract

A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.

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