The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Mar. 07, 2017
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Norikazu Baba, Utsunomiya, JP;

Kiyohito Yamamoto, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G03F 7/00 (2006.01); B05D 3/12 (2006.01); G05B 19/418 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 22/24 (2013.01); B05D 3/12 (2013.01); G03F 7/0002 (2013.01); G05B 19/41875 (2013.01); H01L 21/0271 (2013.01); G05B 2219/32194 (2013.01); H01L 22/12 (2013.01); Y02P 90/22 (2015.11);
Abstract

There is provided a method of performing an analysis of a defect in a pattern of an imprint material on a substrate that has undergone an imprint process of transferring a pattern of a mold onto the substrate. The method includes obtaining a defect distribution of the pattern on the substrate, obtaining map information indicating an arrangement of the imprint material on the substrate, and determining a type of a defect based on a relationship between a position of the defect in the defect distribution and a position of a gap in the imprint material generated in a process of spreading the imprint material by the imprint process, wherein the position of the gap is predicted based on the map information.


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