The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Jan. 27, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Akihiro Horibe, Kawasaki, JP;
Kuniaki Sueoka, Kawasaki, JP;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67721 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/67259 (2013.01); H01L 21/687 (2013.01); H01L 21/6836 (2013.01); H01L 21/6838 (2013.01); H01L 24/81 (2013.01); H01L 24/95 (2013.01); H01L 25/50 (2013.01); H01L 22/12 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81001 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81908 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/9512 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A chip pickup system is provided. The chip pickup system includes a detector for detecting a position of an irregular semiconductor chip on a holder. The holder holding plural semiconductor chips in predetermined positions on the holder. The irregular semiconductor chip is out of the predetermined positions. The system further includes a pickup tool for picking up the irregular semiconductor chip at least on the basis of information on the position of the irregular semiconductor chip detected by the detector.