The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Sep. 28, 2017
Applicant:

Advantest Corporation, Tokyo, JP;

Inventor:

Roland Wolff, Santa Rosa, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01); F28D 15/02 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2874 (2013.01); F28D 15/0233 (2013.01); F28D 15/0266 (2013.01); F28D 15/0275 (2013.01); G01R 31/2877 (2013.01); H01L 23/427 (2013.01); H05K 7/20336 (2013.01); H05K 7/20418 (2013.01); H05K 7/20736 (2013.01); H05K 7/20836 (2013.01); H01L 23/3672 (2013.01);
Abstract

New cooling assembly suitable for use in the testing of devices is disclosed. The new cooling assembly transfers heat that is in close proximity to, within vicinity of, and/or in surrounding area adjacent to a DUT (device under test) undergoing testing to a target location that is away from the DUT. Consequently, the DUT is cooled. By employing heat pipes coupled to plates in contact with the DUT, the new cooling assembly augments cooling capacity at the DUT's location and surrounding area. Yet, the use of an ambient air flow generated by a fan is sufficient to manage and dissipate the heat transferred to the target location. Also, the new cooling assembly is readily installable in DUT testing equipment because its design is quite flexible to adapt to various requirements and space constraints of DUT testing equipment for different DUT footprints or form factors.


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