The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
May. 26, 2017
Applicants:
Board of Trustees of Michigan State University, East Lansing, MI (US);
Fraunhofer Usa, East Lansing, MI (US);
Inventors:
Wen Li, Okemos, MI (US);
Bin Fan, East Lansing, MI (US);
Robert Rechenberg, Vermontville, MI (US);
Michael Becker, East Lansing, MI (US);
Cory Rusinek, Okemos, MI (US);
Assignees:
Board of Trustees of Michigan State University, East Lansing, MI (US);
Fraunhofer USA, East Lansing, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B23K 26/53 (2014.01); A61B 5/04 (2006.01); H01L 21/02 (2006.01); H01L 21/033 (2006.01); H01L 21/04 (2006.01); H01L 21/3065 (2006.01); H01L 21/3213 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/04001 (2013.01); B81B 3/007 (2013.01); B81B 7/0025 (2013.01); H01L 21/02164 (2013.01); H01L 21/02381 (2013.01); H01L 21/02527 (2013.01); H01L 21/0331 (2013.01); H01L 21/0405 (2013.01); H01L 21/3065 (2013.01); H01L 21/32137 (2013.01); A61B 2562/0209 (2013.01); B81B 2201/0214 (2013.01); B81B 2203/04 (2013.01);
Abstract
An implantable device is provided. The implantable device includes a flexible polymeric substrate that extends through an aperture in an electrically conductive material to form an anchor that partially covers the electrically conductive material. Methods for fabricating the implantable device are also provided.