The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Feb. 08, 2019
Applicant:

Covidien Lp, Mansfield, MA (US);

Inventors:

Anthony Sgroi, Jr., Wallingford, CT (US);

Patrick Mozdzierz, Glastonbury, CT (US);

Stephen Paul, East Hartford, CT (US);

David Valentine, Hamden, CT (US);

Scott Firth, Guilford, CT (US);

Assignee:

COVIDIEN LP, Mansfield, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 5/00 (2006.01); H05K 1/02 (2006.01); H01R 12/62 (2011.01); B29C 45/14 (2006.01); A61B 17/115 (2006.01); H05K 5/06 (2006.01); A61B 17/072 (2006.01); B29L 31/34 (2006.01); A61B 17/00 (2006.01); A61B 90/00 (2016.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); A61B 17/07207 (2013.01); A61B 17/1155 (2013.01); B29C 45/14549 (2013.01); B29C 45/14639 (2013.01); B29C 45/14836 (2013.01); H01R 12/62 (2013.01); H05K 1/0281 (2013.01); H05K 5/0026 (2013.01); H05K 5/062 (2013.01); A61B 2017/00017 (2013.01); A61B 2017/0046 (2013.01); A61B 2017/00398 (2013.01); A61B 2017/00473 (2013.01); A61B 2017/00526 (2013.01); A61B 2017/00734 (2013.01); A61B 2090/064 (2016.02); A61B 2090/0813 (2016.02); B29C 45/14065 (2013.01); B29C 2045/14844 (2013.01); B29L 2031/3481 (2013.01); H05K 2203/1316 (2013.01);
Abstract

A method of encapsulating and hermetically sealing a printed circuit board of a flex cable includes: positioning a printed circuit board portion of a flex cable into a channel defined in a first mold half of a mold, the printed circuit board portion including a substrate and electronic components mounted on the substrate; mounting a second mold half onto the first mold half to enclose the channel of the first mold half and form a cavity within the mold; and filling the cavity of the mold with an encapsulation material through an inlet opening defined through the mold.

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