The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Oct. 12, 2018
Applicants:

Yamaha Corporation, Hamamatsu-shi, JP;

Toppan Printing Co., Ltd., Tokyo, JP;

Toyota Tsusho Corporation, Nagoya-shi, JP;

Inventors:

Tetsutsugu Hamano, Fukuroi, JP;

Takahiro Hayashi, Hamamatsu, JP;

Yuma Horio, Hamamatsu, JP;

Tomoaki Taniguchi, Tokyo, JP;

Yuki Muroi, Tokyo, JP;

Takashi Nakamura, Nagoya, JP;

Assignees:

YAMAHA CORPORATION, Hamamatsu-Shi, JP;

TOPPAN PRINTING CO., LTD., Tokyo, JP;

TOYOTA TSUSHO CORPORATION, Nagoya-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/10 (2006.01); H01L 35/32 (2006.01); H01L 35/30 (2006.01); H01L 23/38 (2006.01);
U.S. Cl.
CPC ...
H01L 35/30 (2013.01); H01L 23/38 (2013.01); H01L 35/10 (2013.01); H01L 35/32 (2013.01);
Abstract

A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.


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