The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

Jun. 29, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Eun-Jung Kim, Daegu, KR;

Bong-Soo Kim, Yongin-si, KR;

Yong-Kwan Kim, Yongin-si, KR;

Sung-Hee Han, Hwaseong-si, KR;

Yoo-Sang Hwang, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01); H01L 27/10885 (2013.01); H01L 27/10888 (2013.01);
Abstract

A semiconductor device, including an active region defined in a semiconductor substrate; a first contact plug on the semiconductor substrate, the first contact plug being connected to the active region; a bit line on the semiconductor substrate, the bit line being adjacent to the first contact plug; a first air gap spacer between the first contact plug and the bit line; a landing pad on the first contact plug; a blocking insulating layer on the bit line; and an air gap capping layer on the first air gap spacer, the air gap capping layer vertically overlapping the first air gap spacer, the air gap capping layer being between the blocking insulating layer and the landing pad, an upper surface of the blocking insulating layer being at a height equal to or higher than an upper surface of the landing pad.


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