The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Aug. 29, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Chien-Fa Lee, Hsinchu, TW;
Hsu-Shui Liu, Pingjhen, TW;
Jiun-Rong Pai, Jhubei, TW;
Pin-Yi Hsin, Jhubei, TW;
Shou-Wen Kuo, Hsinchu, TW;
Patrick Lin, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsn-Chu, TW;
Abstract
The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.