The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2020

Filed:

May. 19, 2019
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Kevin G. Werhane, Kuna, ID (US);

Nathaniel J. Meier, Boise, ID (US);

Bin Liu, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/307 (2006.01); G01R 31/30 (2006.01); H03L 7/081 (2006.01); H03K 5/133 (2014.01); H01J 37/26 (2006.01); G01R 31/28 (2006.01); G01R 31/26 (2020.01); G01R 31/50 (2020.01);
U.S. Cl.
CPC ...
G01R 31/307 (2013.01); G01R 31/2858 (2013.01); G01R 31/3016 (2013.01); H01J 37/266 (2013.01); H03K 5/133 (2013.01); H03L 7/0812 (2013.01); G01R 31/2644 (2013.01); G01R 31/2831 (2013.01); G01R 31/50 (2020.01);
Abstract

Apparatuses including test segment circuits and methods for testing the same are disclosed. An example apparatus includes a plurality of segment lines configured to form a ring around a die and a plurality of test segment circuits, each test segment circuit coupled to at least two segment lines of the plurality of segment lines. Each test segment circuit is coupled to a portion of a first signal line, a portion of a second signal line, and a portion of a third signal line and each test segment circuit is configured to control an operation performed on at least one segment line of the plurality of segment lines.


Find Patent Forward Citations

Werhane, Kevin. (2020). Apparatuses including test segment circuits having latch circuits for testing a semiconductor die (U.S. Patent No. 10663513). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10663513

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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