The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Aug. 31, 2016
Mitsubishi Materials Corporation, Tokyo, JP;
Makoto Igarashi, Naka, JP;
Kazutaka Fujiwara, Naka, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A composite member in which WC-based cemented carbide members are bonded to each other via a bonding layer formed by solid phase diffusion bonding of a bonding member made of a Ti foil. The bonding layer is constituted by first layers adjacent to the WC-based cemented carbide members and made of a TiC phase and a metal W phase in which an average area ratio of the TiC phase is 40 to 60%. The bonding layer also includes second layers adjacent to the first layers and made of a TiCo phase and a metal Ti phase in which an average area ratio of the TiCo phase is 50 to 95%, and a residual Ti layer.