The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Dec. 17, 2018
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Wen-Shun Lo, Hsinchu County, TW;

Yu-Chi Chang, Kaohsiung, TW;

Felix Ying-Kit Tsui, Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/426 (2006.01); H01L 29/06 (2006.01); H01L 21/285 (2006.01); H01L 29/66 (2006.01); H01L 29/872 (2006.01); H01L 21/266 (2006.01); H01L 27/08 (2006.01); H01L 21/225 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0619 (2013.01); H01L 21/2253 (2013.01); H01L 21/266 (2013.01); H01L 21/28537 (2013.01); H01L 21/426 (2013.01); H01L 27/0814 (2013.01); H01L 29/0649 (2013.01); H01L 29/66143 (2013.01); H01L 29/872 (2013.01); H01L 27/0629 (2013.01); H01L 29/665 (2013.01); H01L 29/6659 (2013.01);
Abstract

The present disclosure provides a method of manufacturing a Schottky diode. The method includes: providing a substrate; forming a first well region in the substrate; defining a first portion and a second portion on a surface of the first well region and performing a first ion implantation on the first portion while keeping the second portion from being implanted; forming a first doped region by heating the substrate to cause dopant diffusion between the first portion and the second portion; and forming a metal-containing layer on the first doped region to obtain a Schottky barrier interface.


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