The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Sep. 26, 2017
Shanghai Micro Electronics Equipment (Group) Co., Ltd., Shanghai, CN;
Tianming Wang, Shanghai, CN;
Xiaoyu Jiang, Shanghai, CN;
Hai Xia, Shanghai, CN;
Feibiao Chen, Shanghai, CN;
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD., Shanghai, CN;
Abstract
Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (); a substrate supply unit (); a first pick-up assembly () arranged between the chip supply unit () and the substrate supply unit (), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly () comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly () picks up a chip () from the chip supply unit () or the second pick-up assembly (), and delivers the chip () onto a substrate of the substrate supply unit () to complete the bonding; and a vision unit () for realizing the alignment of the chip () and the substrate on the first pick-up assembly (), wherein the chip supply unit (), the substrate supply unit (), the second pick-up assembly () and the vision unit () are respectively located on four work positions of the first pick-up head. The chip () is transported through rotation, improving the productivity of chip () bonding; and the chip () is reversed by utilizing the second pick-up assembly (), which is compatible with two ways of bonding, i.e. a mark face of the chip () facing upwards and downwards.