The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Jan. 25, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Kean Tat Koh, Singapore, SG;
Lien Wah Choong, Singapore, SG;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); B29C 33/28 (2006.01); B29C 33/30 (2006.01); B29C 33/42 (2006.01); H01L 21/56 (2006.01); B29C 43/18 (2006.01); B29C 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/29 (2013.01); B29C 33/28 (2013.01); B29C 33/305 (2013.01); B29C 33/42 (2013.01); B29C 43/003 (2013.01); B29C 43/18 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/31 (2013.01); B29C 2043/181 (2013.01); H01L 23/3107 (2013.01);
Abstract
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.