The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Oct. 16, 2017
Applicant:
Stmicroelectronics Pte Ltd, Singapore, SG;
Inventors:
Assignee:
STMICROELECTRONICS PTE LTD, Singapore, SG;
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B81B 7/0048 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 23/053 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 27/14618 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29198 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83007 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/16151 (2013.01);
Abstract
Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material, thus increasing adhesion between the electric device and a substrate of the package while at the same time allowing for lower adhesive fillets.