The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Jan. 11, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Ryo Terashima, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 27/11582 (2017.01); H01L 27/1157 (2017.01); H01L 21/28 (2006.01); H01J 37/32 (2006.01); H01L 27/11575 (2017.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01J 37/32449 (2013.01); H01L 21/31144 (2013.01); H01L 27/1157 (2013.01); H01L 27/11575 (2013.01); H01L 27/11582 (2013.01); H01L 29/40117 (2019.08); H01J 2237/334 (2013.01);
Abstract

Roughness of an end surface portion of a step shape can be decreased. An etching method includes a first etching process and a second etching process. In the first etching process, etching is performed on a processing target object, which has a silicon-containing film thereon and a photoresist formed on a surface of the silicon-containing film and which is placed in a processing vessel, to etch the silicon-containing film by using the photoresist as a mask. In the second etching process, a first processing gas containing oxygen and halogen is supplied into the processing vessel, or a third processing gas containing the oxygen is supplied into the processing vessel after a second processing gas containing the halogen is supplied into the processing vessel. The first etching process and the second etching process are repeated a multiple number of times.


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