The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

May. 16, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yoshinari Hatazaki, Miyagi, JP;

Wakako Ishida, Miyagi, JP;

Kensuke Taniguchi, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01J 37/32091 (2013.01); H01J 37/32449 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); H01L 21/32135 (2013.01); H01L 21/32137 (2013.01); H01L 21/67069 (2013.01); H01L 21/768 (2013.01); H01J 2237/334 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01);
Abstract

A method of selectively etching a first region Rmade of silicon oxide with respect to a second region Rmade of silicon nitride by performing a plasma processing upon a processing target object is provided. The processing target object has the second region Rforming a recess; the first region Rconfigured to fill the recess; and a mask MK provided on the first region R. The method includes a first process of generating plasma of a processing gas containing a fluorocarbon gas, and a second process of etching the first region with radicals of fluorocarbon contained in a deposit. In the second process, a high frequency power contributing to the generating of the plasma is applied in a pulse shape, and these processes are repeated.


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