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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10658171 B1

PDFFull Text
Date of Patent:
May. 19, 2020

Filed:

Apr. 23, 2019

Wafer processing apparatus

Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Naotoshi Kirihara, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Bac H Au

Int. Cl.
CPC ...
H01L 21/02 (2006.01); B23K 26/384 (2014.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 26/38 (2014.01); B23K 26/402 (2014.01); B23K 26/0622 (2014.01); H01L 21/78 (2006.01); B23K 26/03 (2006.01); B23K 26/40 (2014.01); H01L 21/30 (2006.01); H01L 21/44 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02002 (2013.01); B23K 26/032 (2013.01); B23K 26/0617 (2013.01); B23K 26/0624 (2015.10); B23K 26/0648 (2013.01); B23K 26/0853 (2013.01); B23K 26/38 (2013.01); B23K 26/384 (2015.10); B23K 26/40 (2013.01); B23K 26/402 (2013.01); H01L 21/30 (2013.01); H01L 21/44 (2013.01); H01L 21/78 (2013.01); B23K 2101/40 (2018.08);
Abstract

A laser processing apparatus including a condenser having a function of spherical aberration. Since the condenser has a function of spherical aberration, the focal point of a laser beam to be focused by the condenser and applied to a wafer can be continuously changed in position along the thickness of the wafer. Accordingly, a uniform shield tunnel composed of a fine hole and an amorphous region surrounding the fine hole can be formed so as to extend from the front side of the wafer to the back side thereof, by one shot of the laser beam.

Find Patent Forward Citations

Kirihara, Naotoshi. (2020). Wafer processing apparatus (U.S. Patent No. 10658171). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10658171

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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