The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

May. 17, 2016
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventors:

Kotaro Nagatsu, Ibaraki, JP;

Shinichiro Senda, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); C22F 1/18 (2006.01); C22C 27/02 (2006.01); B22D 7/00 (2006.01); C23C 14/14 (2006.01); C22F 1/00 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3426 (2013.01); B22D 7/005 (2013.01); C22C 27/02 (2013.01); C22F 1/18 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C23C 14/3414 (2013.01); C22F 1/00 (2013.01);
Abstract

Provided is a tantalum target, wherein, when a direction normal to a rolling surface (ND), which is a cross section perpendicular to a sputtering surface of a target, is observed via an electron backscatter diffraction pattern method, an area ratio of crystal grains of which a {100} plane is oriented in the ND is 30% or more. An object of the present invention is to provide a tantalum sputtering target in which a deposition rate can be appropriately controlled under high-power sputtering conditions. When sputter-deposition is performed using this kind of a tantalum target, it is possible to form a thin film having superior film thickness uniformity and improve the productivity of the thin film formation process, even for micro wiring.


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