The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2020
Filed:
Apr. 23, 2015
Asml Netherlands B.v., Veldhoven, NL;
Asml Holding N.v., Veldhoven, NL;
Martinus Hendrikus Antonius Leenders, Rhoon, NL;
Niek Elout De Kruijf, Eindhoven, NL;
Mircea Dusa, San Jose, CA (US);
Martijn Houben, 's-Hertogenbosch, NL;
Johannes Gerardus Maria Mulder, Eindhoven, NL;
Thomas Poiesz, Veldhoven, NL;
Marco Adrianus Peter Van Den Heuvel, Waalre, NL;
Paul Van Dongen, Eindhoven, NL;
Justin Johannes Hermanus Gerritzen, Eindhoven, NL;
Antonie Hendrik Verweij, Dussen, NL;
Abraham Alexander Soethoudt, Eindhoven, NL;
ASML Netherlands B.V., Veldhoven, NL;
Abstract
A substrate support, includes: a substrate support location configured to support a substrate, and a vacuum clamping device configured to clamp the substrate on the substrate support location, wherein the vacuum clamping device includes at least one reduced pressure source to create a reduced pressure, at least one vacuum section connected to the at least one reduced pressure source, wherein the at least one vacuum section is configured to attract the substrate towards the substrate support location, and a control device configured to control a spatial pressure profile along the at least one vacuum section with which the substrate is attracted by the vacuum clamping device, wherein the control device includes a substrate shape data input to receive substrate shape data representing shape data of the substrate to be clamped, and wherein the control device is configured to adapt the spatial pressure profile in dependency of the substrate shape data.