The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

Dec. 17, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Ching-Pei Lin, Hsinchu County, TW;

Chuang-Tse Wang, Hsinchu, TW;

Fa-Fu Hu, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/84 (2012.01); G06N 3/08 (2006.01); G06N 3/04 (2006.01); G03F 7/20 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 1/84 (2013.01); G03F 7/20 (2013.01); G03F 7/705 (2013.01); G03F 7/7065 (2013.01); G03F 7/70491 (2013.01); G03F 7/70508 (2013.01); G03F 7/70533 (2013.01); G06N 3/04 (2013.01); G06N 3/08 (2013.01); H01L 21/0274 (2013.01); H01L 21/67259 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 21/67288 (2013.01);
Abstract

A method for automatic inline detection and wafer disposition includes the following steps. An exposure process is performed to wafers in an exposure apparatus. A virtual inspection is performed based on log files of the exposure process. A wafer automatic disposition is performed according to a result of the virtual inspection. An automatic inline detection and wafer disposition system includes a first computer system coupled to an exposure apparatus and a second computer system coupled to the first computer system. The exposure apparatus is configured to perform an exposure process to wafers, and the first computer system is configured to perform a virtual inspection based on log files of the exposure process. The second computer system is configured to receive a result of the virtual inspection and perform a wafer automatic disposition according to the result of the virtual inspection.


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