The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2020

Filed:

May. 22, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Gregory J. Wilson, Kalispell, MT (US);

Paul McHugh, Kalispell, MT (US);

Karthik Ramanathan, Bangalore, IN;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); C23C 16/52 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01); C23C 16/46 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/45544 (2013.01); C23C 16/46 (2013.01); H01L 21/0228 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/68771 (2013.01); H01L 22/20 (2013.01); H01L 22/26 (2013.01); H01L 22/12 (2013.01);
Abstract

Apparatus and methods to deposit a film using a batch processing chamber with a plurality of heating zones are described. The film is deposited on one or more substrates and the uniformity of the deposition thickness is determined at a plurality of points. The heating zones set points are applied to a sensitivity matrix and new temperature or power set points for the heating zones are determined and set. One or more substrates are processed using the new set points and the thickness uniformity is determined and may be adjusted again to increase the uniformity.


Find Patent Forward Citations

Loading…