The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Apr. 04, 2016
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Mostafa Naguib Abdulla, Rancho Cordova, CA (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/38 (2006.01); H04L 1/00 (2006.01); G11C 5/02 (2006.01); G11C 7/10 (2006.01); G11C 5/04 (2006.01); G11C 29/28 (2006.01); G11C 29/00 (2006.01);
U.S. Cl.
CPC ...
H04L 1/0002 (2013.01); G11C 5/02 (2013.01); G11C 5/04 (2013.01); G11C 7/1075 (2013.01); G11C 29/28 (2013.01); G11C 29/783 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01);
Abstract
In various embodiments, a memory module houses memory devices and, in some embodiments, a memory controller. Each of the devices has a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on, for example, a memory device substrate or molded into a plastic mold to create near-field magnetic coupling between the stacked memory devices and, in certain embodiments, the memory controller. Other embodiments are disclosed.