The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Aug. 10, 2018
Applicant:

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Jerry Wu, Irvine, CA (US);

Jun Chen, Kunshan, CN;

Fan-Bo Meng, Kunshan, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 24/60 (2011.01); H01R 12/72 (2011.01); H05K 1/11 (2006.01); H01R 4/02 (2006.01); H01R 13/6591 (2011.01); H01R 13/58 (2006.01); H01R 107/00 (2006.01); H01R 13/6592 (2011.01); H01R 24/00 (2011.01); H01R 12/59 (2011.01); H01R 24/64 (2011.01); H01R 24/62 (2011.01); H01R 24/50 (2011.01); H01R 13/6593 (2011.01); H01R 12/77 (2011.01); H01R 9/05 (2006.01);
U.S. Cl.
CPC ...
H01R 24/60 (2013.01); H01R 4/02 (2013.01); H01R 12/724 (2013.01); H01R 12/725 (2013.01); H01R 13/6591 (2013.01); H05K 1/111 (2013.01); H05K 1/117 (2013.01); H01R 9/0515 (2013.01); H01R 12/592 (2013.01); H01R 12/596 (2013.01); H01R 12/775 (2013.01); H01R 13/5804 (2013.01); H01R 13/6592 (2013.01); H01R 13/6593 (2013.01); H01R 24/00 (2013.01); H01R 24/50 (2013.01); H01R 24/62 (2013.01); H01R 24/64 (2013.01); H01R 2107/00 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A plug connector assembly includes a housing, a printed circuit board, a cable, and a wire management block, the printed circuit board including first conductive pads and second conductive pads, the cable including plural first core wires and second core wires, the first core wire including a first inner conductor and a shielding layer, the second core wire including a second inner conductor, wherein the wire management block is provided with a plurality of clamping slots, the second core wire is clamped in the clamping slot and exposes the second inner conductor to the front side of the wire management block, the first inner conductors are arranged in a row and soldered to the first conductive pads at one time, the second inner conductors and the shielding layers are arranged in a row and soldered to the second conductive pads of the printed circuit board at one time.


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