The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Dec. 11, 2018
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Daniel Tutuc, St. Niklas an der Drau, AT;

Christian Fachmann, Fuernitz, AT;

Franz Hirler, Isen, DE;

Maximilian Treiber, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/265 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 21/225 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0634 (2013.01); H01L 21/2253 (2013.01); H01L 29/0615 (2013.01); H01L 29/0619 (2013.01); H01L 29/1095 (2013.01); H01L 29/402 (2013.01); H01L 29/404 (2013.01); H01L 29/66712 (2013.01); H01L 29/7811 (2013.01); H01L 21/26513 (2013.01); H01L 21/324 (2013.01);
Abstract

A method for forming a field-effect semiconductor device includes providing a wafer having a substantially compensated semiconductor layer extending to an upper side and including a semiconductor material which is co-doped with n-type dopants and p-type dopants. A peripheral area laterally surrounding an active area are defined in the wafer. Trenches in the active area are filled with a substantially intrinsic semiconductor material. More p-type dopants than n-type dopants are diffused from the compensated semiconductor layer into the intrinsic semiconductor material to form a plurality of p-type compensation regions in the trenches which are separated from each other by respective n-type drift portions. P-type dopants are introduced at least into a semiconductor zone of the peripheral area, so that the semiconductor zone and a dielectric layer on the upper side form an interface. A horizontal extension of the interface is larger than a vertical extension of the trenches.


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