The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Aug. 09, 2016
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Dae Hui Jo, Suwon-si, KR;

Han Lee, Suwon-si, KR;

Mi Sun Hwang, Suwon-si, KR;

Jeong Min Cho, Suwon-si, KR;

Myung Sam Kang, Suwon-si, KR;

Seok Hwan Ahn, Suwon-si, KR;

Tae Hoon Kim, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.


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