The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Mar. 30, 2019
Applicant:

Shandong University of Science and Technology, Qingdao, Shandong, CN;

Inventors:

Qing Wang, Shandong, CN;

Jintao Zhang, Shandong, CN;

Rui Zhang, Shandong, CN;

Xu Zheng, Shandong, CN;

Lijun Ma, Shandong, CN;

Xingyuan Zhang, Shandong, CN;

Wenquan Du, Shandong, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B29C 59/02 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 59/026 (2013.01); B82Y 40/00 (2013.01);
Abstract

A mold with cavities for nanoimprint lithography and a method of imprinting the same. The mold is a one-piece structure, including an upper mold and a lower mold which are welded together. The upper mold is evenly provided with a plurality of stepped holes. A plurality of grooves are provided at an upper surface of the lower mold. Both ends of each groove are respectively connected to an external high-pressure water pump and an external vacuum pump via pipelines. An airtight cavity is additionally provided at the interior of the mold to form a negative pressure in the cavity by vacuumizing during the imprint process. In the demolding, a crack is formed at the interface between the mold and the imprint resist by using water pressure and expands to the entire interface for the demolding of the imprinted structure.


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