The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

Sep. 01, 2016
Applicants:

L'air Liquide, Société Anonyme Pour L'etude ET L'exploitation Des Procédés Georges Claude, Paris, FR;

Clément Lansalot-matras, Princeton, NJ (US);

Jooho Lee, Seoul, KR;

Jean-marc Girard, Versailles, FR;

Nicolas Blasco, Grenoble, FR;

Satoko Gatineau, Seoul, KR;

Inventors:

Clément Lansalot-Matras, Princeton, NJ (US);

Jooho Lee, Seoul, KR;

Jean-Marc Girard, Versailles, FR;

Nicolas Blasco, Grenoble, FR;

Satoko Gatineau, Seoul, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/12 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01); C23C 8/80 (2006.01); H01L 21/02 (2006.01); B08B 9/08 (2006.01);
U.S. Cl.
CPC ...
C23F 1/12 (2013.01); C23C 8/80 (2013.01); H01L 21/31116 (2013.01); H01L 21/31122 (2013.01); H01L 21/32135 (2013.01); H01L 21/67069 (2013.01); B08B 9/083 (2013.01); H01L 21/02244 (2013.01); H01L 21/02247 (2013.01);
Abstract

Disclosed are processes of removing layers from substrates using fluorinated reactants having the formula MF(adduct), wherein x ranges from 2 to 6 inclusive; n ranges from 0 to 5 inclusive; M is selected from the group consisting of P, Ti, Zr, Hf, V, Nb, Ta, Mo, and W; and the adduct is a neutral organic molecule selected from THF, dimethylether, diethylether, glyme, diglyme, triglyme, polyglyme, dimethylsulphide, diethylsulphide, or methylcyanide. The fluorinated reactants dry etch the nitride layers without utilizing any plasma.


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