The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2020

Filed:

May. 13, 2016
Applicant:

Bystronic Laser Ag, Niederönz, CH;

Inventors:

Roland Bader, Rütschelen, CH;

Andreas Lüdi, Burgdorf, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/352 (2014.01); B23K 26/14 (2014.01); B23K 26/38 (2014.01); B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/064 (2014.01);
U.S. Cl.
CPC ...
B23K 26/352 (2015.10); B23K 26/032 (2013.01); B23K 26/064 (2015.10); B23K 26/0648 (2013.01); B23K 26/1476 (2013.01); B23K 26/38 (2013.01);
Abstract

A laser-machining device includes an arrangement for producing and guiding a working laser beam. The arrangement includes a nozzle having an opening for emission of the working laser beam to a machining zone. An optical axis is defined in the arrangement and at least one element focuses the working laser beam near the opening of the nozzle. The machining process is monitored via at least one group of detector arrangements for a radiation characteristic of the machining process and an associated evaluating unit. The detector arrangements of each group are arranged in a ring shape about the optical axis. The observation direction of the detector arrangements extends, at least in a sub-region, between the focusing element closest to the machining zone and the machining zone, at a polar angle, in relation to the optical axis of the working laser beam.


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