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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10645818 B1

PDFFull Text
Date of Patent:
May. 05, 2020

Filed:

Nov. 06, 2017

Soldering method

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Mamoru Kakuishi, Tochigi, JP;

Ryuji Ukai, Tokyo, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 31/02 (2006.01); H05K 3/34 (2006.01); B23K 1/008 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/38 (2006.01); B23K 1/00 (2006.01); B23K 103/12 (2006.01); B23K 101/42 (2006.01); C22C 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3463 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 31/02 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/38 (2013.01); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); C22C 13/00 (2013.01);
Abstract

A solder scattering is prevented at the time of reflow and the oxide films formed on the surfaces of solder or electrodes are thoroughly removed. The soldering method according to the present invention contains the steps of: applying solder paste to the electrode on a printed circuit board and mounting an electronic part on the solder paste, volatilizing the residue-free flux contained in the solder paste by heating the printed circuit board in a chamber set to be a vacuum state and approximately 180 degree C. at the time of pre-heating (interval A), removing oxide films formed on the electrode and the like by heating the printed circuit board in the chamber set to be a formic acid atmospheric state and the temperature of approximately 200 degree C. at the time of reducing (interval B), and melting solder powder contained in the solder paste by heating the printed circuit board in the chamber set to be a vacuum state and the temperature of 250 degree C. at the time of main heating (interval C).

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