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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10643934 B1

PDFFull Text
Date of Patent:
May. 05, 2020

Filed:

Jan. 09, 2019

Wiring substrate and electronic component device

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Tomoyuki Shimodaira, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/15 (2013.01); H01L 23/3142 (2013.01); H01L 23/3157 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 21/563 (2013.01);
Abstract

A wiring substrate include a pad, an insulation layer having an opening arranged on the pad, a metal post including a seed layer and a metal plated layer, the seed layer arranged on the pad and an upper surface of the insulation layer, the metal plated layer arranged on the seed layer, and a connection metal layer formed on the metal plated layer. A side surface of the metal plated layer has a concave surface recessed inward from a lower end of the connection metal layer. A side surface of the seed layer is recessed inward from a lower end of the metal plated layer.

Find Patent Forward Citations

Shimodaira, Tomoyuki. (2020). Wiring substrate and electronic component device (U.S. Patent No. 10643934). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10643934

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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