logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10643929 B1

PDFFull Text
Date of Patent:
May. 05, 2020

Filed:

May. 12, 2014

Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Benjamin Michael Sutton, Dallas, TX (US);

Sreenivasan K Koduri, Allen, TX (US);

Subhashish Mukherjee, Bangalore, IN;

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Dawn Jos

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Steven B Gauthier

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/4951 (2013.01); H01L 23/5227 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Find Patent Forward Citations

Sutton, Benjamin. (2020). Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies (U.S. Patent No. 10643929). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10643929

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…