The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Mar. 21, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Akira Fujita, Kumamoto, JP;

Tsuyoshi Mizuno, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 3/02 (2006.01); C23F 1/08 (2006.01); C23F 1/02 (2006.01); G03F 7/16 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); C23F 1/16 (2006.01); C23F 1/32 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02052 (2013.01); B08B 3/02 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); C23F 1/02 (2013.01); C23F 1/08 (2013.01); C23F 1/16 (2013.01); C23F 1/32 (2013.01); G03F 7/168 (2013.01); H01L 21/67051 (2013.01); H01L 21/67253 (2013.01); H01L 21/68764 (2013.01); H01L 22/20 (2013.01); H01L 21/02087 (2013.01); H01L 22/12 (2013.01);
Abstract

Provided is a substrate processing apparatus that removes a film by supplying a processing liquid to the peripheral edge of a substrate. An ejection unit ejects the processing liquid to the peripheral edge of the substrate held and rotated by a substrate holding unit. An ejection position setting unit sets the ejection position of the processing liquid of the ejection unit to correspond to the removal width of the film included in a recipe, and a property information acquisition unit acquires property information of the film to be removed. A correction amount acquisition unit acquires the correction amount for correcting the ejection position of the processing liquid based on the property information of the film, and an ejection position correction unit corrects the ejection position of the processing liquid by the ejection unit based on the correction amount acquired by the correction amount acquisition unit.


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