The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10642161 B1

PDF
Full Text
Expired
Date of Patent:
May. 05, 2020

Filed:

Oct. 10, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Daniel A. Corliss, Waterford, NY (US);

Scott D. Halle, Slingerlands, NY (US);

Richard C. Johnson, Selkirk, NY (US);

Christopher F. Robinson, Hyde Park, NY (US);

Chumeng Zheng, San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70475 (2013.01); G03F 7/70358 (2013.01); G03F 7/70525 (2013.01); G03F 7/70633 (2013.01);
Abstract

Systems, methods and computer program products generally include a vector by vector subtraction method per wafer. A first layer is exposed to form a pattern image on a wafer and the overlay data of alignment registration marks at multiple locations relative to alignment registration marks of a baseline reference are measured. The first layer is then reworked and exposed to form the same pattern image and the overlay data of alignment registration marks at multiple locations relative to alignment registration marks of a first layer are measured. The overlay data of the reworked first layer is subtracted from the overlay data of the first layer to provide an overlay difference at each of the multiple locations. The overlay difference is converted to a pre-correction factor of a magnitude opposite that of the overlay difference and is applied to exposure of a second layer provided on the first layer.


Find Patent Forward Citations

Loading…