The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Oct. 14, 2016
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Chih-Fan Hu, Taoyuan, TW;

Chia-Wei Lee, Kaohsiung, TW;

Chang-Sheng Hsu, Hsinchu, TW;

Weng-Yi Chen, Zhubei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); G01N 27/12 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 3/0081 (2013.01); G01N 27/128 (2013.01); B81B 2201/0214 (2013.01); B81B 2201/0292 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01);
Abstract

A semiconductor sensor, comprising a gas-sensing device and an integrated circuit electrically connected to the gas-sensing device, is provided. The gas-sensing device includes a substrate having a sensing area and an interconnection area in the vicinity of the sensing area, an inter-metal dielectric (IMD) layer formed above the substrate in the sensing area and in the interconnection area, and an interconnect structure formed in the interconnection area. The interconnect structure includes a tungsten layer buried in the IMD layer, wherein part of a top surface of the tungsten layer is exposed by at least a via. The interconnect structure further includes a platinum layer formed in said at least the via, wherein the platinum (Pt) layer directly contacts the top surface of the tungsten layer.


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