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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10639833 B1

PDFFull Text
Date of Patent:
May. 05, 2020

Filed:

Mar. 29, 2017

Molding system with movable mold tool

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Chau Fatt Chiang, Melaka, MY;

Khar Foong Chung, Perak, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:

Mohammad M Choudhry

Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 45/17 (2006.01); B29C 45/02 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); H01L 21/67 (2006.01); B29K 105/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1756 (2013.01); B29C 45/02 (2013.01); B29C 45/14336 (2013.01); B29C 45/1671 (2013.01); H01L 21/565 (2013.01); H01L 21/67126 (2013.01); B29C 45/1635 (2013.01); B29K 2105/0058 (2013.01); B29L 2031/3481 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01);
Abstract

An apparatus for molding a physical body comprising at least two mold materials, wherein the apparatus comprises a first mold tool and a second mold tool configured for defining a mold volume in between in which the physical body is moldable by supplying the at least two mold materials, and a supply unit configured for separately supplying the at least two mold materials to the mold volume, wherein at least part of at least one of the first mold tool and the second mold tool is movable to thereby increase the dimension of the mold volume after having supplied the first mold material to the mold volume and before and/or during supplying the second mold material to the mold volume.

Find Patent Forward Citations

Chiang, Chau. (2020). Molding system with movable mold tool (U.S. Patent No. 10639833). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10639833

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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