The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Oct. 25, 2018
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Xian-Qin Hu, Qinhuangdao, CN;

Mei Yang, Qinhuangdao, CN;

Cheng-Jia Li, Qinhuangdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/18 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 3/0023 (2013.01); H05K 3/18 (2013.01); H05K 3/185 (2013.01); H05K 3/4076 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 3/4661 (2013.01); H05K 3/4691 (2013.01); H05K 2201/096 (2013.01); H05K 2203/0703 (2013.01);
Abstract

A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.


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