The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jul. 11, 2018
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Xinshu Cai, Singapore, SG;

Shyue Seng Tan, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Danny Pak-Chum Shum, Caspian, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/06 (2006.01); H01L 27/32 (2006.01); H01L 49/02 (2006.01); H01L 27/07 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 27/0629 (2013.01); H01L 27/0711 (2013.01); H01L 27/3265 (2013.01); H01L 29/66545 (2013.01); H01L 29/66871 (2013.01);
Abstract

A method of forming an integrated circuit with a metal-insulator-poly (MIP) capacitor formed in a high-k metal gate (HKMG) process and the resulting device are provided. Embodiments include a device including a metal gate; a high-k dielectric layer formed around side walls of the metal gate, and a dummy polysilicon gate adjacent to at least one portion of the high-k dielectric layer. The device also includes a capacitor including the HK layer as an insulator, wherein the insulator is between a dummy as one electrode and the metal gate as another electrode.


Find Patent Forward Citations

Loading…